211-gptgp7000ulm-0.100-02-0808-nd gap pad 8x8" sheet 0.100"

Item number: GPTGP7000ULM-0.100-02-0808

Category: Berquist Thermal conductive materials

224,16 €

including 19% VAT., plus shipping

Available now! (Shipping time: 3 - 4 workdays)
Description

BERGQUIST GAP PAD TGP 7000ULM

FEATURES AND BENEFITS

- Thermal Conductivity: 7 W/m-K
- High-compliance, low compression stress
- Ultra low modulus

BERGQUIST GAP PAD TGP 7000ULM is an extremely soft gap filling material rated at a thermal conductivity of 7.0 W/m-K.

It is specially formulated for high performance applications requiring low assembly stress. The material offers exceptional thermal performance at low pressures due to the unique filler package and ultra low modulus resin formulation.

BERGQUIST GAP PAD TGP 7000ULM is highly conformal to rough or irregular surfaces, allowing excellent wet-out at the interface. Protective liners are supplied on both sides allowing for ease of use.

TYPICAL APPLICATIONS

- Telecommunications (routers, switches, base stations)
- Optical transceivers
- ASICs and DSPs

TYPICAL PROPERTIES OF CURED MATERIAL

Physical Properties

Hardness, Shore 000, ASTM D2240 75
Inherent Surface Tack 2
Density, ASTM D792, g/cc 3.2
Heat Capacity, ASTM E1269, J/g-K 1.1
Shelf life, days 180
Young's Modulus kPa 152
 (psi) (22)

Electrical Properties

Dielectric Constant, ASTM D150, 1,000Hz 8.7
Dielectric Breakdown Voltage :
40 mil sample, VAC >5,000
Volume Resistivity, ASTM D257, ohm-meter 1.2×1011

Thermal Properties

Thermal Conductivity, ASTM D5470, W/(m-K) 7.0