BERGQUIST SIL PAD TSP Q2000
FEATURES AND BENEFITS
- Thermal impedance: 0.35ºC-in2 /W @ 50 psi
- Eliminates processing constraints typically associated with grease
- Conforms to surface textures
- Easy handling
- May be installed prior to soldering and cleaning without worry
TYPICAL APPLICATIONS
- Between a transistor and a heat sink
- Between two large surfaces such as an L-bracket and the chassis of an assembly
- Between a heat sink and a chassis
- Under electrically isolated power modules or devices such as resistors, transformers and solid state relays
BERGQUIST SIL PAD TSP Q2000 eliminates problems associated with thermal grease such as contamination of electronic assemblies and reflow solder baths.
BERGQUIST SIL PAD TSP Q2000 may be installed prior to soldering and cleaning without worry. When clamped between two surfaces, the elastomer conforms to surface textures thereby creating an air-free interface between heat-generating components and heat sinks. Fiberglass reinforcement enables BERGQUIST SIL PAD TSP Q2000 to withstand processing stresses without losing physical integrity. It also provides ease of handling during application.
TYPICAL PROPERTIES
Physical Properties
Hardness, Shore A, ASTM D2240 86
Flammability Rating, UL 94 V-0
Electrical Properties
Dielectric Breakdown Voltage , ASTM D149, Vac Non-Ins ulating
Dielectric Constant, ASTM D150 @ 1,000 Hz NA
Volume Resistivity, ASTM D257, ohm-meter 1×102
Thermal Properties
Thermal Conductivity , ASTM D5470, W/(m-K) 2.0
Thermal Performance vs. Pressure
TO-220 Thermal Performance, ºC/W
@ 10 psi 2.26
@ 25 psi 1.99
@ 50 psi 1.76
@ 100 psi 1.53
@ 200 psi 1.3
Thermal Impedance, ASTM D5470, ºC-in2 /W (1)
@ 10 psi 0.65
@ 25 psi 0.48
@ 50 psi 0.35
@ 100 psi 0.24
@ 200 psi 0.16