BERGQUIST SIL PAD TSP 1600S
FEATURES AND BENEFITS
- Thermal impedance: 0.61ºC-in2 /W @ 50 psi
- Electrically isolating
- Low mounting pressures
- Smooth and highly compliant surface
- General-purpose thermal interface material solution
TYPICAL APPLICATIONS
- Power supplies
- Automotive electronics
- Motor controls
- Power semiconductors
BERGQUIST SIL PAD TSP 1600S thermally conductive insulation material is designed for a wide variety of applications requiring high thermal performance and electrical Isolation.
These applications also typically have low mounting pressures for component clamping.
BERGQUIST SIL PAD TSP 1600S material combines a smooth and highly compliant surface characteristic with high thermal conductivity. These features optimize the thermal resistance properties at low pressure.
Applications requiring low component clamping forces include discrete semiconductors (TO-220, TO-247 and TO-218) mounted with spring clips. Spring clips assist with quick assembly but apply a limited amount of force to the semiconductor.
The smooth surface texture of BERGQUIST SIL PAD TSP 1600S minimizes interfacial thermal resistance and maximizes thermal performance.
TYPICAL PROPERTIES
Physical Properties
Shore Hardness, ASTM D2240, Shore A 92
Elongation , 45º to warp and fill, ASTM D412,% 20
Tensile Strength, ASTM D412, MPa 9
Flammability Rating, UL 94 V-0
Electrical Properties
Dielectric Breakdown Voltage , ASTM D149, Vac 5,500
Dielectric Constant, ASTM D150 @ 1,000 Hz 6.0
Volume Resistivity, ASTM D257, ohm-meter 1×1010
Thermal Properties
Thermal Conductivity , ASTM D5470, W/(m-K) 1.6
Thermal Performance vs. Pressure
TO-220 Thermal Performance, ºC/W
@ 10 psi 3.96
@ 25 psi 3.41
@ 50 psi 2.9
@ 100 psi 2.53
@ 200 psi 2.32
Thermal Impedance, ASTM D5470, ºC-in2 /W (1)
@ 10 psi 0.95
@ 25 psi 0.75
@ 50 psi 0.61
@ 100 psi 0.47
@ 200 psi 0.41