BERGQUIST BOND PLY TBP 800
FEATURES AND BENEFITS
- Thermal impedance: 0.6ºC-in2 /W @ 50 psi
- High bond strength to most epoxies and metals
- Double-sided, pressure sensitive adhesive tape
- High performance, thermally conductive acrylic adhesive
- More cost-effective than heat-cure adhesive, screw mounting or clip mounting
TYPICAL APPLICATIONS
- Mount LED assembly to troffer housing
- Mount LED assembly to heat sink
- Mount heat spreader onto power converter PCB or onto motor control PCB
- Mount heat sink onto BGA graphic processor or drive processor
BERGQUIST BOND PLY TBP 800 is a thermally conductive, electrically isolating double-sided tape. BERGQUIST BOND PLY TBP 800 is utilized in lighting applications that require thermal transfer and electric isolation.
High bond strengths obtained at ambient temperature lead to significant processing cost savings in labor, materials and throughput due to the elimination of mechanical fasteners and high temperature curing.
TYPICAL PROPERTIES
Physical Properties
Elongation , 45º to warp and fill, ASTM D412,% 70
Coefficient of Thermal Expansion, ASTM D 3386, ppm/°C 600
Flammability Rating, UL 94 V-0
Tensile Strength MPa 10 (psi) (1,500)
Adhesion Properties
Lap Shear Strength @ 25 °C,
ASTM D1002 (1)
MPa 1.0
(psi) (150)
Electrical Properties
Dielectric Breakdown Voltage , ASTM D149:
@ 0.005" (Vac) 4,000
@ 0.008" (Vac) 6,000
Dielectric Constant , ASTM D150 @ 1,000 Hz 4.0
Volume Resistivity, ASTM D257, ohm-meter 1×1011
Thermal Properties
Thermal Conductivity , ASTM D5470, W/(m-K) 0.8
Thermal Performance vs. Pressure
TO-220 Thermal Performance, ºC/W:
@ 0.005":
@ 10 psi 5.0
@ 25 psi 5.0
@ 50 psi 4.8
@ 100 psi 4.3
@ 200 psi 4.2
@ 0.008":
@ 10 psi 6.2
@ 25 psi 6.0
@ 50 psi 5.6
@ 100 psi 5.3
@ 200 psi 5.2
Thermal Impedance, ASTM D5470, ºC-in2 /W (2):
@ 0.005":
@ 10 psi 0.63
@ 25 psi 0.62
@ 50 psi 0.6
@ 100 psi 0.58
@ 200 psi 0.57
@ 0.008":
@ 10 psi 0.78
@ 25 psi 0.74
@ 50 psi 0.72
@ 100 psi 0.71
@ 200 psi 0.71