BERGQUIST GAP PAD TGP EMI1000
FEATURES AND BENEFITS
- Thermal Conductivity: 1.0 W/m-K
- Electromagnetic Interference (EMI) absorbing
- Highly Conformable, low hardness
- Fiberglass reinforced for puncture, shear and tear resistance
- Electrically isolating
BERGQUIST GAP PAD TGP EMI1000 is a highly conformable, combination gap filling material offering both thermal conductivity performance and Electromagnetic Energy absorption (cavity resonances and/or cross-talk causing Electromagnetic Interference) at frequencies of 1GHz and higher. The material offers EMI suppression and 1.0 W/m-K thermal conductivity performance with low assembly stress.
The soft nature of the material enhances wet-out at the interface resulting in better thermal performance than harder materials with a similar performance rating.
BERGQUIST GAP PAD TGP EMI1000 has an inherent, natural tack on one side of the material eliminating the need for thermally-impeding adhesive layers and allowing improved handling during placement and assembly. The other side is tack-free, again enhancing handling and rework, if required.
BERGQUIST GAP PAD TGP EMI1000 is supplied with a protective liner on the material’s tacky side.
TYPICAL APPLICATIONS
- Consumer electronics
- Telecommunications
- ASICs and DSPs
- PC applications
TYPICAL PROPERTIES OF CURED MATERIAL
Young's modulus is calculated using 0.01 in/min, step rate of
strain with a sample size 0.79 inch².
Relaxation stress @ 40 mil.
Physical Properties
Hardness, Shore 00, Thirty second delay value, ASTM D2240, Bulk rubber 5
Heat Capacity, ASTM E1269, J/g-K 1.3
Density, Bulk rubber, ASTM D792, g/cc 2.4
Flammability, UL 94 V-0
Young's Modulus, ASTM D575 kPa 69
(psi) (10)
Electrical Properties
Dielectric Breakdown Voltage , ASTM D149, VAC >1,700
Dielectric Constant, ASTM D150, 1,000Hz 6.0
Volume Resistivity, ASTM D257, ohm-meter 1×1010
Thermal Properties
Thermal Conductivity, ASTM D5470, W/(m-K) 1.0
Thermal Impedance, 0.040 inch
ASTM D5470, ºC-in2 /W:
10% Deflection 1.53
20% Deflection 1.4
30% Deflection 1.25
The recorded value includes interfacial thermal resistance.
These values are provided for reference only. Actual application performance is directly related to the surface roughness, flatness and pressure applied.
EMI Properties
Based on waveguide testing with 60 mil thickness testing EMI Performance ASTM D-5568-01, dB/cm:
@ 2.4, GHz -2.8
@ 5, GHz -5.5