BERGQUIST GAP PAD TGP EMI1000
FEATURES AND BENEFITS
- Thermal Conductivity: 1.0 W/m-K
- Electromagnetic Interference (EMI) absorbing
- Highly Conformable, low hardness
- Fiberglass reinforced for puncture, shear and tear resistance
- Electrically isolating
BERGQUIST GAP PAD TGP EMI1000 is a highly conformable, combination gap filling material offering both thermalconductivity performance and Electromagnetic Energyabsorption (cavity resonances and/or cross-talk causing Electromagnetic Interference) at frequencies of 1GHz and higher. The material offers EMI suppression and 1.0 W/m-K thermal conductivity performance with low assembly stress.
The soft nature of the material enhances wet-out at the interface resulting in better thermal performance than harder materials with a similar performance rating.
BERGQUIST GAP PAD TGP EMI1000 has an inherent, natural tack on one side of the material eliminating the need for thermally-impeding adhesive layers and allowing improved handling during placement and assembly. The other side is tack-free, again enhancing handling and rework, if required.
BERGQUIST GAP PAD TGP EMI1000 is supplied with a protective liner on the material’s tacky side.
TYPICAL APPLICATIONS
- Consumer electronics
- Telecommunications
- ASICs and DSPs
- PC applications
TYPICAL PROPERTIES OF CURED MATERIAL
Young's modulus is calculated using 0.01 in/min, step rate of strain with a sample size 0.79 inch².
Relaxation stress @ 40 mil.
Physical Properties
Hardness, Shore 00 , Thirty second delay value, ASTM D2240, Bulk rubber 5
Heat Capacity, ASTM E1269, J/g-K 1.3
Density, Bulk rubber, ASTM D792, g/cc 2.4
Flammability, UL 94 V-0
Young's Modulus, ASTM D575 kPa 69
(psi) (10)
Electrical Properties
Dielectric Breakdown Voltage , ASTM D149, VAC >1,700
Dielectric Constant, ASTM D150, 1,000Hz 6.0
Volume Resistivity, ASTM D257, ohm-meter 1×1010
Thermal Properties
Thermal Conductivity, ASTM D5470, W/(m-K) 1.0
Thermal Impedance, 0.040 inch
ASTM D5470, ºC-in2 /W:
10% Deflection 1.53
20% Deflection 1.4
30% Deflection 1.25