BERGQUIST GAP PAD TGP 1100SF
FEATURES AND BENEFITS
- Thermal Conductivity: 0.9 W/m-K
- No silicone outgassing
- No silicone extraction
- Reduced tack on one side to aid in application assembly
- Electrically isolating
BERGQUIST GAP PAD TGP 1100SF is a thermally conductive, electrically insulating, silicone-free polymer specially designed for silicone-sensitive applications. The material is ideal for applications with high standoff and flatness tolerances.
BERGQUIST GAP PAD TGP 1100SF is reinforced for easy material handling and added durability during assembly. The material is available with a protective liner on both sides of the material. The topside has reduced tack for ease of handling.
TYPICAL APPLICATIONS
- Digital disk drives / CD-ROM
- Automotive modules
- Fiber optics modules
TYPICAL PROPERTIES OF CURED MATERIAL
Young's modulus is calculated using 0.01 in/min, step rate of strain with a sample size 0.79 inch².
Physical Properties
Hardness, Shore 00, Thirty second delay value,
ASTM D2240, Bulk rubber 40
Heat Capacity, ASTM E1269, J/g-K 1.1
Density, Bulk rubber, ASTM D792, g/cc 2.0
Flammability, UL 94 V-1
Young's Modulus, ASTM D575 kPa 234
(psi) (34)
Electrical Properties
Dielectric Breakdown Voltage , ASTM D149, VAC >6,000
Dielectric Constant, ASTM D150, 1,000Hz 5.0
Volume Resistivity, ASTM D257, ohm-meter 1×1010
Thermal Properties
Thermal Conductivity, ASTM D5470, W/(m-K) 0.9