Berquist Thermal conductive materials - Page 2 of 4

Bergquist Gap Pads are suitable for air gaps, uneven surfaces and rough surface textures. They provide promising thermal interfaces between electronic devices and heat sinks. To reduce contact resistance, the soft construction of the thermally conductive pad offers high conformability. GAP PADs help reduce stress in connections, plus they are compatible with automatic dispensing systems.

The GAP PAD line is particularly well suited for applications where only low pressure is allowed between components because of its shock-absorbing properties. Furthermore, silicone-free versions are also available for sensitive applications.

Thermally conductive insulation pads meet the complex requirements, of the rapidly changing electronics industry. SIL PADs provide an effective alternative to ceramics, mica or grease for a wide variety of electronics applications. They are extremely cost effective, cleaner to process than greases, more durable than rubber, and feature excellent thermal conductivity.