BERGQUIST SIL PAD TSP K900
BERGQUIST SIL PAD TSP K900 is designed and developed
in conjunction with DuPont. BERGQUIST SIL PAD TSP K900
combines the thermal transfer properties of well known Sil-Pad
rubber wit high dielectric strength, physically tough DuPont
Kapton MT file.
Kapton MT is a specially developed film which has high
thermal conductivity. The result is a durable insulator that
withstands high voltages, requires no thermal grease to
transfer heat, is available in customized shapes and sizes and
saves time and costs while increasing productivity.
TYPICAL PROPERTIES
Physical Properties
Hardness, Shore A, ASTM D2240 90
Breaking Strength, ASTM D1458, KN/m 5
Elongation , 45º to warp and fill, ASTM D412,% 40
Tensile Strength, ASTM D412, MPa 35
Electrical Properties
Dielectric Breakdown Voltage , ASTM D149 (VAC, min) 6,000
Dielectric Constant, ASTM D150 @ 1,000 Hz 5.0
Volume Resistivity, ASTM D257, ohm-meter 1×1012
Thermal Properties
Thermal Conductivity , ASTM D5470, W/(m-K) 0.9
Thermal Resistance Bergquist Flat Plate Test
Method, ºC-in2 /W 0.4
Thermal Vacuum Weight Loss (TML), as
manufactured, NASA SP-R-0022A, % 0.28
Volatile Condensable Material (VCM), as
manufactured, NASA SP-R-0022A, % 0.07