BERGQUIST SIL PAD TSP 1600S
FEATURES AND BENEFITS
Thermal impedance: 0.61ºC-in2 /W @ 50 psi
Electrically isolating
Low mounting pressures
Smooth and highly compliant surface
General-purpose thermal interface material solution
TYPICAL APPLICATIONS
Power supplies
Automotive electronics
Motor controls
Power semiconductors
BERGQUIST SIL PAD TSP 1600S thermally conductive insulation material is designed for a wide variety of applications requiring high thermal performance and electrical isolation. These applications also typically have low mounting pressures for component clamping.
BERGQUIST SIL PAD TSP 1600S material combines a smooth and highly compliant surface characteristic with high thermal conductivity. These features optimize the thermal resistance properties at low pressure.
Applications requiring low component clamping forces include discrete semiconductors (TO-220, TO-247 and TO 218) mounted with spring clips. Spring clips assist with quick assembly but apply a limited amount of force to the semiconductor.
The smooth surface texture of BERGQUIST SIL PAD TSP 1600S minimizes interfacial thermal resistance and maximizes thermal Performance.