BERGQUIST GAP PAD TGP 5000
FEATURES AND BENEFITS
- High Thermal Conductivity: 5.0 W/m-K
- Highly conformable, “S-Class” softness
- Natural inherent tack reduces interfacial thermal resistance
- Conforms to demanding contours and maintains structural integrity with little or no stress applied to fragile component leads
- Fiberglass reinforced for puncture, shear and tear resistance
- Excellent thermal performance at low pressures
BERGQUIST GAP PAD TGP 5000 is a fiberglass-reinforced filler and polymer featuring a high thermal conductivity. The material yields extremely soft characteristics while maintaining elasticity and conformability. The fiberglass reinforcement provides easy handling and converting, added electrical isolation and tear resistance. The inherent natural tack on both sides assists in application and allows the product to effectively fill air gaps, enhancing the overall thermal performance.
The top side has reduced tack for ease of handling. BERGQUIST GAP PAD TGP 5000 is ideal for high-performance applications at low mounting pressures.
TYPICAL APPLICATIONS
- Voltage Regulator Modules (VRMs) and POLs
- CD ROM/DVD ROM
- PC Board to chassis
- ASICs and DSPs
- Memory packages/modules
- Thermally-enhanced BGAs
TYPICAL PROPERTIES OF CURED MATERIAL
Young's modulus is calculated using 0.01 in/min, step rate of strain with a sample size 0.79 inch².
Physical Properties
Hardness, Shore 00, Thirty second delay value, ASTM D2240, Bulk rubber 35
Heat Capacity, ASTM E1269, J/g-K 1.0
Density, Bulk rubber, ASTM D792, g/cc 3.6
Flammability, UL 94 V-0
Young's Modulus, ASTM D575 kPa 310
(psi) (45)
Electrical Properties
Dielectric Breakdown Voltage , ASTM D149, VAC >5,000
Dielectric Constant, ASTM D150, 1,000Hz 7.5
Volume Resistivity, ASTM D257, ohm-meter 1×109
Thermal Properties
Thermal Conductivity, ASTM D5470, W/(m-K) 5.0
Thermal Impedance, 0.040 inch
ASTM D5470, ºC-in2 /W:
10% Deflection 0.41
20% Deflection 0.34
30% Deflection 0.3