BERGQUIST SIL PAD TSP A3000
FEATURES AND BENEFITS
- Thermal impedance: 0.32ºC-in2 /W @ 50 psi
- Optimal heat transfer
- High Thermal Conductivity: 3.0 W/m-K
TYPICAL APPLICATIONS
- Motor drive controls
- Avionics
- High-voltage power supplies
- Power transistor / heat sink interface
BERGQUIST SIL PAD TSP A3000 is a conformable elastomer with very high thermal conductivity that acts as a thermal interface between electrical components and heat sinks.
BERGQUIST SIL PAD TSP A3000 is for applications where optimal heat transfer is a requirement.
This thermally conductive silicone elastomer is formulated to maximize the thermal and dielectric performance of the filler/binder matrix. The result is a grease-free, conformable material capable of meeting or exceeding the thermal and electrical requirements of high reliability electronic packaging applications.
TYPICAL PROPERTIES
Physical Properties
Hardness, Shore A, ASTM D2240 90
Heat Capacity, ASTM E1269, J/g-K 1.0
Flammability Rating, UL 94 V-0
Electrical Properties
Dielectric Breakdown Voltage , ASTM D149, Vac 4,000
Dielectric Constant, ASTM D150 @ 1,000 Hz 7.0
Volume Resistivity, ASTM D257, ohm-meter 1×1011
Thermal Properties
Thermal Conductivity , ASTM D5470, W/(m-K) 3.0
Thermal Performance vs. Pressure
TO-220 Thermal Performance, ºC/W
@ 0.015"
@ 10 psi 2.05
@ 25 psi 1.94
@ 50 psi 1.86
@ 100 psi 1.79
@ 200 psi 1.72
Thermal Impedance, ASTM D5470, ºC-in2 /W (1)
@ 0.015"
@ 10 psi 0.53
@ 25 psi 0.4
@ 50 psi 0.32
@ 100 psi 0.28
@ 200 psi 0.26